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Flux remover. Free of organic solvents, tenside-free - non-foaming, alkaline, pH 11.7 (1 %). Application in the ultrasonic bath: 10 %, 30 to 180 s, 60 to 70 °C. Contamination: Resinous flux, soldering pastes, ionic- and non-ionic residues, drilling-, grinding-, polishing- and lapping residues, fingerprints, grease, oils etc. Objects to be cleaned: Printed circuit boards, printed-board assemblies, soldering frames, electronic components and assemblies, parts made of metal, glass, ceramics, plastics, rubber etc. Caution with alkali- and water-sensitive parts. |
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