Flux remover. Free of organic solvents, tenside-free - non-foaming, alkaline, pH 10.7 (1 %). Application 10 %, 30 to 180 s.
Resinous flux, soldering pastes, ionic- and non-ionic residues, drilling-, grinding-, polishing- and lapping residues, fingerprints, fat, oil etc.
Objects to be cleaned:
Printed circuit boards, printed-board assemblies, soldering frames, electronic components and assemblies, parts made of metal, glass, ceramics, plastics, rubber etc. Caution with alkali- and water-sensitive parts.